Based upon experience with many of the world’s most advanced IC Substrate and HDI manufacturers, C Sun has developed the CSL-A25U II cut sheet laminator. The CSL A-25U II will process substrates between .05mm – 3.2mm at up to 4 panels per minute with unparalleled accuracy and quality. The system uses a two stage "soft" panel alignment and a patented dual roller design to ensure precise high pressure uniformity of over 98% at 5 Kgf/cm2 across the substrate. A specially designed vacuum system contributes to thin substrate handling by precisely controlling film application. The lamination chamber of the CSL A-25U II is also designed as a clean room within a clean room. Stainless steel is used extensively throughout the system.
Power: AC220V 3f 60HZ 15KVA 39A
Outer Dimension: L:1575 x W:2160x H:2100 (mm)
Pass Line: Height:950~1000 mm
Panel Size: Length & Width:250 ~ 640 mm
Thickness: 0.05mm (w/o copper; single cu thickness >=1/3oz) ~ 3.2 mm
Roller: Stainless steel with fine polish, f31.5mm,P=63 mm
Structure: Movable. D/F quick change over. Easy maintenance.
Panel Centering: Roller type. Two stages moving speed.
Hot Roller: f80 mm
Heater: 1.5 KW x 2 pieces
Conveyor Speed: 1 ~ 5 M/min Adjustable
Roller Temperature: 50~120?±3.5? (MAX:130?) Induction heating mode
Control Panel: Color touch screen
Roller Pressure: Compressed air 1 ~5 KG / cm2
Vacuum: 5 positions. Air supplied by venturi blower system.
Roller: Stainless steel with fine polish, f31.5mm ,P=66mm
Structure: Movable. Easy maintenance.
Copper Position Accuracy: ±1.0mm
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