LIR – ICP + RIE Plasma System

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PRODUCT INFORMATION

Applicable Fields:
Photovoltaic
LED
SEMI(FEOL/BEOL)
MEMS
Packaging

Applications:
Surface Conditioning
Surface Modification
Cleaning – Wafer or Substrate
Desmear – Descum
Metal Etching
Dielectric Etching (Oxide,Nitride)
Sapphire, Silicon, Metal etching
Wafer Thinning
Stress Relief
Compound Semi-Etching (GaN, GaAs, AlGaN, AlGaInP)

Product Profile:
1 x RF ICP Source – coil type (upper electrode)
1 x RF CCP Source – plate type (lower electrode)

Reactor Design:
Cylindrical Chamber with single wafer stage

Vacuum System:   
Main – lateral 1 x dry pump + 1x turbo
Molecular pump
Loadlock – 1x dry pump

Pressure regulation:
Throttle Opening Control (%)

Gas:
Up to 7 MFC’s

Etching Mechanism:
Hybrid/Chemical Reaction / Physical Bombardment- directional

Cooling mechanism:
C Sun ATR (Advanced Thermal Regulation) – backside
Helium cooling w. mechanical chucking (built in)
ESC (optional)
Water Cooling (optional)

Transfer Mechanism:
Loadlock/Cluster

Available Sizes:       
100mm, 150mm, 200mm, 300mm ( 4”, 6”, 8”, 12”)

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