The mechanical pressure exerted on the
product being assembled in many automated manufacturing processes is often
unevenly distributed, especially during the solder paste printing and component
placement processes used in the printed circuit assembly process. Tactile
support can damage substrates and components. Defects caused can include
deformed, broken, or bent leads as well as package damage. As substrates become
thinner the risk increases.
VacuNest is a unique, patented system
which uses shape memory tooling to conform to and provide support of almost any
substrate on any machine. Setting up the system in a paste printer or pick
& place system takes minutes, and it takes less than a minute to
reconfigure the support for a new part number.
By using soft conformal surfaces, a pliable
anti-static chamber, a foam former and polymer granules held in place by
vacuum, The VacuNest provides maximum support with no hard surfaces which can
damage delicate substrates.
is provided across the entire substrate
risk of damage to underside components
and precise support
be reconfigured for any job in under 60 seconds.
and easy to install or move
be used in a wide range of industries and applications
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